PRODUCTION PROCESS FOR PRINTED CIRCUIT BOARDS

PRODUCTION PROCESS FOR PRINTED CIRCUIT BOARDS

Challenge

Molded Interconnect Devices (MID) are electronic components, in which metallic conductor tracks are applied to injection-molded plastic carriers. Areas of application of this technology can be found in automotive engineering, industrial automation, medical technology or telecommunications.

Innovation

The invention describes a cost-effective method for applying conductor tracks to arbitrarily shaped, three-dimensional surfaces. The application can be carried out manually as well as partially or completely automatically and is cost-effective even with small volumes or individual pieces. The method is based on the known friction coating method.

Commercial Opportunities

Since the introduction in the 1990s, the market for MID technology has been rapidly growing. The market volume of MIDs has more than doubled in the last two years alone, since it offers a high degree of environmental compatibility and an improved design freedom in the combination of electrical and mechanical functions in an injection-molded part.

Development Status

Feasibility was shown. The university offers support for the implementation into a product.

Fig.: Conductive layer by friction coating on a Molded Interconnect Device (MID)
Dr. Tobias Steinel
E-Mail:
Phone:
Reference Number:
tsteinel@baypat.de
+49 (0) 89 5480177 - 39
B70311