Electrical Engineering

Contacting Elements for an Energy Storage Cell

Sep 16, 2019

| Reference: 

B74067

• Easy positioning of the battery cell on the plate

• Contacting of the battery cells only on one side

• Easy and efficient cooling of the cells

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FLEXIBLE AND BREATHABLE NONWOVENS WITH SUPERIOR ELECTRICAL CONDUCTIVITY

Jun 4, 2019

| Reference: 

B76140

• Bendable andbreathable material with metal-like electrical conductivity

• Low silver contentrequired, simple wet-laid process

• For e.g. lightweight electrodesand electric shielding

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BREATHABLE, ULTRA-LIGHTWEIGHT ­ELECTROCONDUCTIVE FOAMS

Jun 4, 2019

| Reference: 

B74226

• Flexible, breathablefoams with high electro-conductivity

• Simple, scalablemetallization process (using e.g. copper or silver)

• Fast heating capacity

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PIEZOELECTRIC ELECTROMAGNETIC INTERFERENCE FILTER

Apr 8, 2019

| Reference: 

B78011

• Effective Filtering of electromagnetic disturbances
• High tunability
• Low-cost and broad applicability

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DOUGH RELAXATION TROUGH ELECTROMAGNETIC PULSES

Feb 25, 2019

| Reference: 

B78143

• Drastic shortening of the baking time
• Easy processability of the dough
• High controllability of the preparation parameter

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ACOUSTIC DETECTION OF LIQUID DROPLETS ON SOLID SURFACES

Dec 18, 2018

| Reference: 

B69126

  • Large area monitoring with few acoustic sensors
  • Continuous monitoring of industrial infrastructure
  • Droplet position detection
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ECONOMICAL MOSFETMULTI- LEVEL-CONVERTER

Nov 23, 2018

| Reference: 

B77014

  • Economical MOSFET-based Power Converter
  • High Efficiency Electromobility
  • Broad Range and Flexibility of Conversion Applications

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SNIP: A NEW SEMICONDUCTOR MATERIAL

Nov 23, 2018

| Reference: 

B75074

  • Tin phosphor iodide (SnIP) is a new semiconductor material
  • Photoluminescence in the visible makes it interesting for solar cells and light emitting diodes
  • First inorganic double helix structure material
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THz AND MIR SOURCE AT ROOM TEMPERATURE IN DFG-QCLs

Nov 7, 2018

| Reference: 

B76162

  • THz sources at room temperature operation
  • Wide choice of substrate and wave-guide form
  • Compact, robust and easy to operate
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CONCEPT FOR HERMETIC, LOW HEAT, MINIMUM INDUCTION PACKAGING FOR SEMICONDUCTOR CHIPS

Oct 17, 2018

| Reference: 

B76018

  • Efficient protection from the atmosphere
  • Thermal resistance reduction
  • Induction and parasitics effects reduction.
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