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• Piezoelectric electromagnetic interference filter

  B78011

  Piezoelectric electromagnetic interference filter

  • Highly effective filtering of electromagnetic disturbances
  • Enables size and weight reduction of EMI filters
  • Low-cost and broad applicability
• Electrical connection pads with improved solderability

  B79040

  Electrical connection pads with improved solderability

  • Stronger connection of components to PCBs
  • Long term laser activation of solder pads
  • Works for most standard materials
• Broadband antenna having polarization dependent output

  B77173

  Broadband antenna having polarization dependent output

  • Easy to manufacture on multilayer substrate
  • Efficient dual-polarized broadband operation
  • Ability to be operated as a phased array
• Contacting Elements for an Energy Storage Cell

  B74067

  Contacting Elements for an Energy Storage Cell

  • Easy positioning of the battery cell
  • Contacting of the battery cells only on one side
  • Easy and efficient cooling of the cells
• Economical mosfet-multi-level-converter

  B77014

  Economical mosfet-multi-level-converter

  • Economical MOSFET-based Power Converter
  • High Efficiency Electromobility
  • Broad Range and Flexibility of Conversion Applications
• Wear-Leveling Circuitry for Aging ­ Effects Mitigation

  B78090

  Wear-Leveling Circuitry for Aging ­ Effects Mitigation

  • Aging mitigation in SRAMs sense amplifiers
  • Low-cost circuitry
  • Minimal performance and read-overhead increase
• Flexible and breathable nonwovens with superior electrical conductivity

  B76140

  Flexible and breathable nonwovens with superior electrical conductivity

  • Bendable and breathable material with metal-like electrical conductivity
  • Low silver content required, simple wet-laid process
  • For e.g. lightweight electrodes and electric shielding
• Filter banks and methods for operating filter banks

  B75223

  Filter banks and methods for operating filter banks

  • Novel implementation of DFT- based modulated filter banks
  • Less space used on the chip and longer battery lifetime
  • Wide range of applications in digital signal processing
• Dough relaxation through electromagnetic pulses

  B78143

  Dough relaxation through electromagnetic pulses

  • Drastic shortening of the baking time
  • Easy processability of the dough
  • High preparation parameters controllability
• Concept for hermetic, low heat, minimum ­induction packaging for semiconductor chips

  B76018

  Concept for hermetic, low heat, minimum ­induction packaging for semiconductor chips

  • Efficient protection from the atmosphere
  • Thermal resistance reduction
  • Induction and parasitics effects reduction
• Digital audio amplifier for high output ­power and variable supply voltage

  B72041

  Digital audio amplifier for high output ­power and variable supply voltage

  • Multi Channel Systems
  • Active Loudspeakers
  • High-end-amplifier

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